Leadframe for conductive winding
US11855540B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2019 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | May 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M3/003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device includes a circuit assembly and a first conductive winding support having a first end attached to the circuit assembly and having a first winding support surface a first distance from the circuit assembly. The device also includes a second conductive winding support having a second end attached to the circuit assembly and having a second winding support surface a second distance from the circuit assembly, the second distance being different than the first distance. A conductive winding has first and second winding ends. The first winding end is attached to the first winding support surface, and the second winding end is attached to the second winding support surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.