Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device
US11856687B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2021 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Dec 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20254
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.