Stretchable 3D-printed circuit boards
US11856708B2 · kind B2 · utility
0Cited by
5References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2022 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Mar 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4682
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are devices comprising stretchable 3D circuits and methods for fabricating the circuits. The fabrication process includes providing in the elastomeric polymer as a substrate and providing conductive interconnects within the substrate encased in an insulating polymer, such as polyimide, to provide a stiffness gradient between the conductive interconnects and the flexible elastomeric substrate. The circuit may be fabricated as a multilayer construction using three-dimensional pillars as vias and as external interconnects to the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.