Integrated thermoelectric devices on insulating media
US11856857B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 19, 2020 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Dec 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/853
Abstract
The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically and thermally nonconductive substrate with cylindrical or frustum-shaped tunnels. The tunnels may be filled with thermally and electrically conductive materials that resist diffusion. The structures include n-type and p-type materials, in homogeneous form or alternating with interlayers to block phonon conduction between layers of thermoelectric materials. The tunnels are individually associated with either n-type or p-type thermoelectric materials and connected in pairs to form alternating conductors on both sides of the substrate. The structures may also be coated with layers of gold and nickel and have thermoelectric materials deposited in the tunnels. The tunnels may be partially or fully capped with sintered nano-silver or solder. Notches may alternate sides to electrically isolate each side of the structure to provide current flow between the p-type and n-type thermoelectric layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.