In-situ vapor injection thermal desorption device
US11858017B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2022 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Sep 11, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB09C2101/00
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
An in-situ vapor injection thermal desorption device includes a sectional combined input head, several intermediate connectors and a bottom protector connected in series from top to bottom. The in-situ vapor injection thermal desorption device further includes several water-vapor coupling injection activation chips, selectively disposed below any of the intermediate connectors; the sectional combined input head is provided with a high-pressure-gas inlet, several pairs of heat-transfer-oil inlets and heat-transfer-oil outlets, and several pairs of hot-water inlets and hot-water outlets; the water-vapor coupling injection activation chip is provided with several gas-liquid spraying holes. The disclosure is an assembling structure; the number of the water-vapor coupling injection activation chips can be increased or reduced according to remediation depth on an actual site; it can be repeatedly used, uniformly sprayed, and enables the vapor for treating the organic soil to be generated in situ and remediating organic pollution sites in a low-carbon, energy-saving way.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.