Robotic manipulator systems and methods involving non-planar and/or deformable support structures

US11858139B1 · kind B1 · utility

Assignee

• AMAZON TECHNOLOGIES, INC. · US

Inventors

• Can Erdogan · Berlin, DE
• Kiru Park · Berlin, DE
• Johannes Kulick · Berlin, DE
• Zoltan Beck · Rockville, US
• Michael Nalin Mistry · Pittsburgh, US
• Lesley Yu · Somerville, US

Key dates

• Filing date: Aug 27, 2021
• Grant date: Jan 2, 2024
• Expiry date: Nov 28, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G06V2201/06
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

Systems, methods, and systems are disclosed for a robotic manipulator system including a robotic manipulator, a controller, one or more sensors, and a support structure. The support structure may be non-planar and/or deformable and may be designed to support an object on an upper surface. The one or more sensors may be directed towards the support structure and object. The controller and/or another computing device in communication with the controller may determine geometry of the support structure and may know or determine a compression value of the support structure. Using the compression value and/or geometry of the support structure, the controller may cause the robotic manipulator to grasp the object from the support structure and move the object to a new location.