3D thermoformed element
US11858431B2 · kind B2 · utility
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2References
4Claims
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Key dates
| Filing date | Aug 22, 2019 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Aug 12, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24992
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional vacuum thermal insulation element having a compressed three-dimensional porous structure and a shell closed in an airtight manner. The shell includes a thermoformable barrier wall and encloses the porous structure arranged between two major surfaces of said barrier wall. The porous structure has a pressure of between less than 105 Pa and more than 10-2 Pa at ambient external temperature and pressure. The barrier wall is thermoformed at the site of said two major surfaces, between which the porous structure has a curved shape and/or reliefs and/or depressions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.