Pouch forming mold configuration, and method
US11858671B2 · kind B2 · utility
0Cited by
15References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Mar 18, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D75/327
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A mold configuration for forming a pocket in a film comprising: a film support surface; a perimeter edge at said film support surface; wall surfaces inward of the perimeter edge defining a mold cavity; the wall surfaces including transition wall surfaces extending to a bottom wall surface; and a plateau surface inward of the perimeter edge. In one form, the perimeter edge includes sharp corner profile perimeter edge portions defining at least one sharp corner profile. A method of forming a pouch, includes using the disclosed mold configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.