Micromechanical structure and micromechanical sensor

US11858805B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Stefan Kiesel · Reutlingen, DE
• Cristian Nagel · Reutlingen, DE
• Sebastian Guenther · Lörrach, DE

Key dates

• Filing date: Sep 7, 2021
• Grant date: Jan 2, 2024
• Expiry date: Sep 7, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/0862
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical structure, including a substrate, a seismic mass movable with respect to the substrate, and first and second detectors. A first direction and a second direction perpendicular to the first direction define a main extension plane of the substrate. The first and second detectors respectively detect a translatory deflection, and a rotatory deflection. The seismic mass is connected to the substrate via an anchoring element and four torsion spring sections. The first detector include an electrode structure, including first electrodes attached at the seismic mass and second electrodes attached at the substrate. The first and second electrodes have a two-dimensional extension in the second direction and in a third direction perpendicular to the main extension plane. The anchoring element includes first and second sections with a gap between them. A connecting element connects two first electrodes and is guided through the gap.