Vertical shear weld wafer bonding
US11858806B2 · kind B2 · utility
0Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Aug 21, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/038
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In described examples, a first metal layer is configured along a periphery of a cavity to be formed between a first substrate and a second substrate. A second metal layer is adjacent the first metal layer. The second metal layer includes a cantilever. The cantilever is configured to deform by bonding the first substrate to the second substrate. The deformed cantilevered is configured to impede contaminants against contacting an element within the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.