Patent · US Active

Polyamides with phosphorous and al-phosphonates

US11859068B2 · kind B2 · utility

0Cited by

15References

10Claims

0Family size

Assignee

BASF SE

Inventors

Michael Roth · Herbstein, DE
Michaela Heussler · Haßloch, DE
Klaus Uske · Bad Dürkheim, DE
Christoph Minges · Ludwigshafen, DE

Key dates

Filing date	Jun 21, 2018
Grant date	Jan 2, 2024
Priority date	—
Expiry date	Dec 17, 2039

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2203/16
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Described herein are thermoplastic molding materials including components:A) 10 to 98.5 wt % of a thermoplastic polyamide,B) 1 to 20 wt % of red phosphorus,C) 0.5 to 15 wt % of an aluminum salt of phosphonic acid,D) 0 to 55 wt % of a fibrous or particulate filler or mixtures thereof,E) 0 to 30 wt % of further additives,wherein the weight percentages of the components A) to E) sum to 100%.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.