Patent · US Active

Micromechanical structure and micromechanical sensor

US11860184B2 · kind B2 · utility

0Cited by

0References

8Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Cristian Nagel · Reutlingen, DE
Johannes Classen · Reutlingen, DE
Lars Tebje · Reutlingen, DE
Rolf Scheben · Stuttgart, DE
Rudy Eid · Stuttgart, DE

Key dates

Filing date	Sep 16, 2021
Grant date	Jan 2, 2024
Priority date	—
Expiry date	Sep 16, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG01P2015/0871
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.