Radar arrangement
US11860296B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jan 28, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Nov 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/0457
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radar arrangement includes a printed circuit board (PCB), an electronic component, and an antenna. The electronic component is arranged on the PCB and is used to generate a high-frequency signal. The PCB has at least four electrically conductive layers separated from one another by at least three electrically insulating layers. A first conductive inner layer is adjacent to a first conductive outer layer, and a second conductive inner layer is adjacent to a second conductive outer layer. The electronic component is arranged on the first conductive outer layer. The antenna is formed at least partially in the second outer layer. The signal generated by the electronic component is transmitted to the antenna, which is formed at least partially in the second conductive outer layer of the PCB, through a region of the conductive inner layers and insulating inner layers of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.