Chip packaging in light detection and ranging (LIDAR) sensor system
US11860308B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2022 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Nov 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.