Semiconductor structure and preheating method thereof
US11862223B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 7, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Mar 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06596
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure and a preheating method thereof are provided. The semiconductor structure includes: a storage chip; a temperature detection unit configured to detect a temperature of the storage chip before the storage chip initiates; and a control chip configured to: before the storage chip initiates, heat the storage chip and determine whether the temperature detected by the temperature detection unit reaches a specified threshold; and if the temperature reaches the specified threshold, control the storage chip to initiate. When the semiconductor structure provided in the present invention works at a low temperature, the storage chip may be heated to the specified threshold, thereby preventing an increase of the resistances on the bit line, the word line, and the metal connection line in the storage chip, and improving the performance of read/write operations of the memory.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.