Semiconductor device having a planar III-N semiconductor layer and fabrication method
US11862459B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2022 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Jun 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/817
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a planar III-N semiconductor layer includes a substrate including a wafer and a buffer layer of a buffer material different from a material of the wafer, the buffer layer having a growth surface, an array of nanostructures epitaxially grown from the growth surface, a continuous planar layer formed by coalescence of upper parts of the nanostructures at an elevated temperature T, where the number of lattice cells spanning a center distance between adjacent nanostructures are different at the growth surface and at the coalesced planar layer, and a growth layer epitaxially grown on the planar layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.