Interposer and semiconductor package each having conductive terminals on redistribution layer with different pitch
US11862551B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 18, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Feb 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5385
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interposer, including a redistribution layer structure, first conductive terminals, and second conductive terminals, is provided. The first conductive terminals are disposed on a first surface and are electrically connected to the second conductive terminals. An orthographic projection area of the first conductive terminals on the redistribution layer structure is inside a circuit range outline. There is a first pitch between the adjacent first conductive terminals. The second conductive terminals are disposed on a second surface. An orthographic projection area of a first part of the second conductive terminals on the redistribution layer structure is inside the circuit range outline. An orthographic projection area of a second part of the second conductive terminals on the redistribution layer structure is outside the circuit range outline. There is a second pitch between the adjacent second conductive terminals. The second pitch is greater than the first pitch. A semiconductor package is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.