Curved imaging sensor package with architected substrate

US11862653B2 · kind B2 · utility

Assignee

• HRL Laboratories, LLC · US

Inventors

• Mark O'Masta · Oak Park, US
• Jacob M. Hundley · Newbury Park, US
• Eric C. Clough · Santa Monica, US
• Christopher S. Roper · Oak Park, US
• Geoffrey P. McKnight · Los Angeles, US

Key dates

• Filing date: Dec 3, 2020
• Grant date: Jan 2, 2024
• Expiry date: Jun 16, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/809

Abstract

An imaging sensor package includes: an imaging sensor; and an architected substrate coupled to a bottom surface of the imaging sensor. The architected substrate has local stiffness variations along an in-plane direction of the architected substrate, and the imaging sensor and the architected substrate are curved.