Patent · US Active

One-dimensional metallization for solar cells

US11862745B2 · kind B2 · utility

1Cited by
3References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 13, 2020
Grant dateJan 2, 2024
Priority date
Expiry dateJan 22, 2040

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/547

Abstract

Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.