Laser diode packaging module, distance detection device, and electronic device
US11862929B2 · kind B2 · utility
0Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Dec 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4056
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure provides a laser diode package module. The laser diode package module includes a substrate including a first surface; a cover disposed on the first surface of the substrate; an accommodation space formed between the substrate and the cover; a laser diode die disposed in the accommodation space; and a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface and transmitted through a light-transmitting area. The light-transmitting area is at least partially disposed on a surface of the cover opposite the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.