Method for forming metal pattern
US11864325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2020 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Sep 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/015
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method for forming a metal pattern on a pattern formation section set on a base material. In the present invention, a substrate provided with a fluorine-containing resin layer on a surface of the base material including the pattern formation section is used. The present inventive method for forming a metal pattern includes steps of: forming a functional group on the pattern formation section; and applying a metal ink including an amine compound and a fatty acid as protective agents to the base material surface to fix the metal particles on the pattern formation section. In the present invention, a fluorine-containing resin having a surface free energy measured by the Owens-Wendt method of 13 mN/m or more and 20 mN/m or less is applied as the fluorine-containing resin layer. Further, a metal ink including ethyl cellulose as an additive is applied as the metal ink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.