Aluminum or copper foil heat dissipator and electronic device having the same
US11864356B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 28, 2022 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Mar 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20472
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device having an aluminum or copper foil heat dissipator includes a casing, an electronic structure disposed in the casing, and an aluminum or copper foil heat dissipator. A surface of the electronic structure has a heat source element. The aluminum or copper foil heat dissipator is a 3D aluminum or copper foil structure formed by stamping and includes a bottom, a surrounding portion, and a 3D space formed between the bottom and the surrounding portion. The bottom is thermal conductively coupled to the heat source element. A surface of the aluminum or copper foil heat dissipator is partially/entirely thermal conductively coupled to an inner surface of the casing. With the characteristics of aluminum or copper foil that is easy to expand into a 3D shape during processing and could closely fit the inner surface, the heat generated by the heat source element could be dissipated from the 3D aluminum or copper foil with a large contact area, achieving better heat dissipation effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.