Power supply device with a heat generating component
US11864362B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2022 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Apr 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M3/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.