Integration of semiconductor membranes with piezoelectric substrates
US11864465B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | May 22, 2020 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Aug 5, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/48721
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Piezoelectrically actuated devices constructed from thin semiconductor membranes bonded directly to piezoelectric substrates are provided. Methods for fabricating these devices are also provided. The bonding of the semiconductor to the piezoelectric material does not require the use of any intermediate layers, such as bonding agents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.