Mold clamping device of injection molding machine and method of adjusting mold thickness of mold clamping device
US11865756B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 7, 2020 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Apr 26, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2945/76869
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold clamping device of an injection molding machine includes a mold clamping shaft fixed to a movable platen, a mold clamping ram to press the mold clamping shaft against a fixed platen, a ram position detecting member that detects a position of the mold clamping ram, an encoder detecting a position of the movable platen, a ram position control member that hydraulically controls a position of the mold clamping ram, a storage unit storing a difference value of mold closing positions of the movable platen before and after mold replacement, and a control unit. The control unit calculates the difference value when mold thickness adjustment is performed, calculates a movement position of the mold clamping ram based on a current position of the mold clamping ram and the difference value, moves the mold clamping ram to the movement position, and stops the mold clamping ram to perform mold clamping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.