Support structure, and printing method and printing system therefor
US11865786B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2019 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Nov 9, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y80/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An illustrative example support structure includes a solid portion printed using a first material and a non-solid portion printed using a second material. The solid portion includes a grid structure, and both inside and outside of each grid unit of the grid structure are filled with the non-solid portion. Hardness of the first material is different from hardness of the second material. A grid density of the grid structure varies within a printing plane, and/or an area of a cross-section of a connecting edge of the grid unit varies in a direction perpendicular to the printing plane. There are differences in strength of different portions of the support structure of the present disclosure, so that an adverse effect of cracking of the support structure caused by a stress concentration phenomenon occurring when the support structure is subjected to a stress during or after a curing process can be effectively prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.