Method for transferring an embossed structure to the surface of a coating means and compound structure usable as an embossing die
US11865858B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2019 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Jan 16, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7562
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a method for transferring an embossed structure to a surface of a coating composition (B2a), which includes the steps (1-i) and (2-i) or (1-ii) and (2-ii) and also the steps (3) and optionally (4), where the steps (1-i) and (2-i) or (1-ii) and (2-ii) are performed using a composite (F1B1) which is employed as an embossing die (p2) of an embossing tool (P2) and which is composed of a substrate (F1) and of an at least partially embossed and at least partially cured coating (B1), and the coating composition (B1a) used for producing (B1) of the composite (F1B1) is a radiation-curable coating composition of defined constitution. Also described herein is a composite (F1B1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.