Heat-curing epoxy resin composition having high storage stability
US11866544B2 · kind B2 · utility
0Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2018 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Jul 7, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/53
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A one-component thermosetting epoxy resin compositions that feature good storage stability. The epoxy resin compositions are especially suitable for use as bodywork adhesive and for production of structural foams.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.