Polymer substrate with hard coat layer
US11866564B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 28, 2018 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Apr 3, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2483/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is a polymer substrate with a hard coat layer, which is obtained by directly laminating a polymer substrate, a base cured layer and a silicon oxide layer, wherein the base cured layer has a thickness of 1-20 μm and contains 10-90 parts by weight of a polyfunctional acrylate and 90-10 parts by weight of inorganic oxide fine particles and/or a hydrolytic condensation product of a silicon compound or contains a hydrolytic condensation product of an organic silicon compound as a primary component, and the silicon oxide layer satisfies requirement (a1) below at a position 0.04 μm in the thickness direction from the interface between the base cured layer and the silicon oxide layer and satisfies requirement (a3) below at the surface of the silicon oxide layer on the opposite side from the interface,
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.