Molding powder
US11866570B2 · kind B2 · utility
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5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2023 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Jan 9, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y10/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molded body which is formed from a shaping material containing a fluororesin powder. The fluororesin powder has a D50 of 30 μm or more and 200 μm or less and a D10 of 12 μm or more. Also disclosed is a method for forming a molded body from a shaping material containing the fluororesin powder, the method including controlling the temperature of the fluororesin powder; and irradiating the fluororesin powder with a laser at the controlled temperature to fuse the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.