Wave-absorbing impregnation glue liquid, wave-absorbing honeycomb, and preparation methods thereof
US11866616B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Dec 4, 2019 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Jun 25, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided a wave-absorbing impregnation glue liquid, including: two-component epoxy resin, a solvent, a polyether siloxane, and a carbon powder; wherein a mass ratio of the two-component epoxy resin to the solvent is 1:3˜1:5, a mass ratio of the two-component epoxy resin to the carbon powder is 3:1˜6:1, and a mass fraction of the polyether siloxane in the wave-absorbing impregnation glue liquid is 0.05%˜0.2%. A wave-absorbing impregnation glue liquid, a wave-absorbing honeycomb and their preparation methods are further provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.