Conductive polymer composite for adhesion to flexible substrate and method for preparing same
US11866623B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2019 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Sep 19, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/006
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A conductive polymer composite for adhesion to a flexible substrate contains a polymer adhesive containing a curable polymer and a curing agent; and a conductive filler containing a metal and a carbonaceous material dispersed in the polymer adhesive. The conductive polymer composite is suitable for application to not only the human body but also other objects having irregular surface. In addition, due to enhanced adhesive strength of the conductive polymer composite to the flexible substrate, the reduction in conductivity or conductivity breakdown caused by external stress can be prevented and flexibility and stretchability can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.