Patent · US Active

Radiative cooling film and product thereof

US11867434B1 · kind B1 · utility

0Cited by
1References
16Claims
0Family size

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Key dates

Filing dateMar 1, 2021
Grant dateJan 9, 2024
Priority date
Expiry dateMar 1, 2041

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08J2475/14
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A radiative cooling film and a product thereof are provided. The radiative cooling film includes a carrier layer, a reflective layer and an emissive layer stacked together. A light shines on the radiative cooling film from the emissive layer. The emissive layer includes a polymer containing a C—F bond. The carrier layer includes a polymer containing at least one of a C—C bond and a C—O bond. After disposing at 120 degrees centigrade for 30 minutes, a transverse direction heat-shrinkage rate of the carrier layer is less than or equal to 2%, and a machine direction heat-shrinkage rate of the carrier layer is less than or equal to 3%. A thickness of the radiative cooling film is in a range of 50 m to 170 μm, and a thickness of the emissive layer accounts for 20% to 90% of the thickness of the radiative cooling film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.