Radiative cooling film and product thereof
US11867434B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 1, 2021 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Mar 1, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2475/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A radiative cooling film and a product thereof are provided. The radiative cooling film includes a carrier layer, a reflective layer and an emissive layer stacked together. A light shines on the radiative cooling film from the emissive layer. The emissive layer includes a polymer containing a C—F bond. The carrier layer includes a polymer containing at least one of a C—C bond and a C—O bond. After disposing at 120 degrees centigrade for 30 minutes, a transverse direction heat-shrinkage rate of the carrier layer is less than or equal to 2%, and a machine direction heat-shrinkage rate of the carrier layer is less than or equal to 3%. A thickness of the radiative cooling film is in a range of 50 m to 170 μm, and a thickness of the emissive layer accounts for 20% to 90% of the thickness of the radiative cooling film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.