Photonic chip based atomic sensors
US11867852B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2023 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Jun 23, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P15/093
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments herein describe an atomic sensor that includes a photonic die that outputs optical signals on a top surface. These optical signals can be directed and shaped as needed to satisfy a particular type of atomic sensor. In one embodiment, an atomic source (e.g., rubidium or cesium) is disposed on the photonic chip to emit atoms when heated. A collimator can then direct the emitted atoms along a path that intersects with the optical signals. This intersection can be used to detect motion (e.g., rotation and acceleration) of the atomic sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.