Chip on film, display panel, and method of manufacturing display panel
US11868013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2022 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Oct 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip on film, a display panel, and a method of manufacturing the display panel are provided. The chip on film includes a flexible film and a driver chip. The flexible film includes at least a first group of lines and a second group of lines. M lines of the first group of lines are electrically connected to pins of the driver chip to form driver lines; and N lines of the second group of lines are not electrically connected to any pin of the driver chip, serving as nominal lines. By arranging the nominal lines, a conventional bonding machine may be applied to bond the chip on film to the display substrate. Costs for modifying the bonding machine may be reduced, and application scenarios of the chip on film may be increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.