Touch substrate and manufacturing method thereof
US11868557B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 23, 2021 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Jun 10, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04112
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a touch substrate and a manufacturing method thereof. The touch substrate includes a base substrate and a touch electrode structure in a display area of the base substrate, and further includes a conductive structure and a wiring structure, wherein the conductive structure is in a peripheral area of the base substrate outside the display area, and includes a one-piece layer which is configured to form a lead electrically connected to a driving circuit for the touch electrode structure; and the wiring structure is in a wiring area between the display area and the peripheral area of the base substrate and is configured to electrically connect the conductive structure to the touch electrode structure. With the touch substrate and the manufacturing method of the touch substrate, problems of poor alignment and lapping, increased contact impedance, insufficient adhesive force and the like can be solved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.