Isolated power converter package with molded transformer
US11870341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2022 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Jul 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An isolated power converter package includes a leadframe including a first and second die pad, first and second supports connected to first leads, second leads. A first semiconductor die is on the first die pad and a second semiconductor die is on the second die pad. The molded transformer includes a top and bottom side magnetic sheet each having a magnetic mold material including magnetic particles in a second dielectric material on respective sides of a laminate substrate including a dielectric material and a first coil and a second coil that each include a coil contact. Edges of the laminate substrate are on the supports. Bond wires are between the first die bond pads and the second leads, between the second die bond pads and the second leads, between the first die bond pads and coil contacts, and between the second die bond pads and the coil contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.