Electronic devices with stacked circuitry
US11871517B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2021 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Mar 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device may have a display with an array of pixels for displaying images. The electronic device may also have a lens through which the images are viewable on the display. The display may have a display panel that is mounted to a printed circuit stack. The printed circuit stack may include multiple printed circuit layers to which components are mounted. The components may include an orientation sensor overlapped by the display panel. A camera may be mounted to a printed circuit stack and may overlap one or more electrical components such as an orientation sensor. The printed circuit stacks may include rigid and flexible printed circuits coupled together using solder and other conductive connections. Air gaps may be created between stacked printed circuit layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.