Method for producing a printed wiring board
US11871520B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2020 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Dec 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/013
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a printed circuit board on a substrate uses control data derived from a circuit schematic, CAD file, Gerber file or files or equivalents, to operates a function head configured to effect printing conductive and non-conductive materials on the substrate and produces control data to effect the circuit printing. The method optionally uses a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.