Thin film support structures
US11872043B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2017 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Nov 22, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2556/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method includes forming a film, forming a first pattern of two or more vias at least partially through the film, attaching the film to a first support structure, the first support structure comprising an adhesive layer formed over a first carrier, wherein attaching the film to the first support structure comprises bonding a first surface of the film to the adhesive layer of the first support structure, wherein the film is stretchable in at least a first direction along the first surface, and wherein the first carrier maintains the first pattern of vias within a given threshold distortion following a given process conducted after attaching the film to the first support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.