Diffusion bonded lead connector
US11872392B2 · kind B2 · utility
0Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2021 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Nov 29, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.