Unit plate position fixation method and device and lamination machine
US11872795B2 · kind B2 · utility
0Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2022 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | May 10, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A unit plate position fixation method and device and a lamination machine are provided. The unit plate position fixation method includes: obtaining peripheral position information of unit plates located between two layers of separators; controlling a hot-pressing device according to the peripheral position information to perform hot pressing on the two layers of separators, so that the two layers of separators are adhered at peripheral positions of the unit plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.