Method for producing damper structures on a micromechanical wafer
US11873216B2 · kind B2 · utility
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Key dates
| Filing date | Apr 9, 2020 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Apr 29, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/032
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for producing damper structures on a micromechanical wafer. The method includes: (A) providing an edge adhesive film and a molding wafer, which includes a first side having a molding structure; (B) applying the edge adhesive film to the first side of the molding wafer at a low atmospheric pressure; (C) joining the edge adhesive film to the first side of the molding wafer by increasing the atmospheric pressure; (D) filling the molding structures with an adhesive; (E) curing the adhesive to form damper structures; (F) bonding the damper structures to a second side of a micromechanical wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.