Patent · US Active

Blown films comprising bimodal ethylene-based polymers having high molecular weight high density fractions

US11873377B2 · kind B2 · utility

0Cited by

39References

20Claims

0Family size

Assignee

DOW GLOBAL TECHNOLOGIES LLC · US

Inventors

Kyle E. Hart · Manvel, US
Mehmet Demirors · Terneuzen, NL
Timothy W. Gambrel · Lake Jackson, US
Philip P. Fontaine · Alvin, US
Vivek Kalihari · Missouri City, US
Francis O. Olajide, Jr. · Pearland, US
Rajen M. Patel · Lake Jackson, US

Key dates

Filing date	Jun 13, 2019
Grant date	Jan 16, 2024
Priority date	—
Expiry date	Jul 14, 2040

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2205/025
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A blown film having a bimodal ethylene-based polymer including a high density fraction (HDF) from 3.0% to 25.0%, an I10/I2 ratio from 5.5 to 7.5, a short chain branching distribution (SCBD) less than or equal to 10 C, a zero shear viscosity ratio from 1.0 to 2.5, a density from 0.902 g/cc to 0.925 g/cc, and a melt index (I2) from 0.5 g/10 mins to 2.0 g/10 mins.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.