Patent · US Active

Nanostructures for the assembly of materials

US11873396B2 · kind B2 · utility

0Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 5, 2021
Grant dateJan 16, 2024
Priority date
Expiry dateMar 25, 2042

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2207/53
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Nanostructures and associated compositions, systems, and methods are provided. In some embodiments, a nanostructure may comprise polymers, intermolecular bonding groups, and a particle. The polymers may be associated with the particle and the intermolecular bonding groups may be associated with at least some of the polymers. In some embodiments, at least some of the intermolecular bonding groups may have a different chemical composition and/or chemical property than the polymers. In some embodiments, nanostructures may reversibly associate with each other via the intermolecular bonding groups to form a material. In some such cases, the intermolecular bonding groups on different nanostructures may reversibly associate with each other. In some embodiments, the nanostructures may be designed, such that the energy required to disassociate at least a portion of the nanostructures in the material is greater than the energy required to dissociate a single association between intermolecular bonding groups.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.