Polycrystalline diamond compact
US11873684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2021 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Mar 12, 2041 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/5676
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A polycrystalline diamond compact including a polycrystalline diamond layer and a cemented carbide substrate. The polycrystalline diamond layer is in the form of a cylinder including an upper surface, a bottom surface, and a side wall connecting the upper surface and the bottom surface. The cemented carbide substrate is bonded to the bottom surface of the polycrystalline diamond layer. The upper surface includes a center part and an edge part. The edge part includes a plurality of radially distributed cutting edges and cutting removal grooves. The plurality of cutting edges and cutting removal grooves are alternately distributed on the upper surface. One end of each of the plurality of cutting edges and cutting removal grooves extends to communicate with the center part, and the other end of each of the plurality of cutting edges and cutting removal grooves extends to communicate with the side wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.