Tolerance ring and assembly
US11873865B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 15, 2019 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Nov 23, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16D2300/10
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A tolerance ring including a substrate, and an overlying layer including at least one of a thermal enhancement layer and a retention layer, the thermal enhancement layer including at least one of i) Vickers hardness <400 VPM or ii) a thermal conductivity >100 W/m·K, the tolerance ring being adapted to provide at least one of a) a thermal transfer between the inner member and the outer member, b) a coefficient of friction between the retention layer and the outer member, μ1, and a coefficient of friction between the substrate and the outer member, μ2, and where μ1>μ2, or c) a retention force, Rf, between the inner member and the outer member, and the assembly has an assembly force, Af, and where Rf>0.1 Af, wherein the tolerance ring includes a plurality of projections protruding radially inward or radially outward.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.