Ultrasonic sensor
US11874159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2020 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Sep 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R17/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Ultrasonic sensor (1) includes piezoelectric element (7), first acoustic matching layer (2), and second acoustic matching layer (5) which are laminated and bonded together, piezoelectric element (7) having a rectangular bonding surface. First acoustic matching layer (2), which is adjacent to piezoelectric element (7), is bonded to piezoelectric element (7) using thermoplastic resin injected from a thickness direction of first acoustic matching layer (2) in a manner that a flow direction of the thermoplastic resin matches a longitudinal direction of piezoelectric element (7). With this configuration, ultrasonic sensor (1) that exhibits excellent temperature characteristics against such as thermal shock is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.