Method for laser microdissection, laser microdissection system and computer program

US11874207B2 · kind B2 · utility

Assignee

• LEICA MICROSYSTEMS CMS GMBH · DE

Inventors

• Florian Hoffmann · Ladenburg, DE
• Falk Schlaudraff · Hausen, DE

Key dates

• Filing date: Jan 23, 2020
• Grant date: Jan 16, 2024
• Expiry date: Apr 1, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2001/2886
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for laser microdissection includes: processing a microscopic examination object by a laser beam using tuples of coordinate values which respectively indicate positions of target points on the examination object at least in a first spatial direction and a second spatial direction orthogonal to the first spatial direction, positions of at least three reference points being ascertained beforehand in each case in the first and second spatial directions and also in a third spatial direction orthogonal to the first and second spatial directions; defining a reference plane based on the positions of the reference points; and determining, for the target points, further coordinate values indicating an expected position of the target points on the examination object in the third spatial direction in each case, as determined further coordinate values, the determining of the further coordinate values being performed depending on the defined reference plane.