Method for temperature compensation of a microelectromechanical sensor, and microelectromechanical sensor

US11874291B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Amin Jemili · Aspenhausiedlung, DE
• Jochen Reinmuth · Reutlingen, DE
• Dusan Radovic · Stuttgart, DE
• Rolf Scheben · Stuttgart, DE
• Steffen Becker · Zorneding, DE

Key dates

• Filing date: Apr 27, 2022
• Grant date: Jan 16, 2024
• Expiry date: Apr 27, 2042

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/0862
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for temperature compensation of a MEMS sensor. The method includes: in a balancing step, a temperature gradient is produced by a thermal element and a first and a second temperature are determined at a first and a second temperature measurement point, wherein a deflection of a movable structure produced by the temperature gradient is measured and a compensation value is ascertained dependent on the first and second temperature and the deflection; in a measurement step, a physical stimulus is measured by way of a deflection of the movable structure and a third and fourth temperature is determined at the first and second temperature measurement points; in a compensation step, a measured value of the physical stimulus is ascertained dependent on the measured deflection, the third and fourth temperature and the compensation value. A method is also provided including: a regulation step, and a measurement step.